Adhesive in the Electronic Market Trends and Forecast
The future of the adhesive in the global electronic market looks promising with opportunities in the printed circuit board and semiconductor packaging markets. The adhesive in the global electronic market is expected to reach an estimated $7.7 billion by 2030 with a CAGR of 6.1% from 2024 to 2030. The major drivers for this market are ongoing trend towards miniaturization in electronics, including smaller and more compact devices, growing adoption of electric vehicles (evs) and renewable energy technologies, and strong emphasis on improving the performance and reliability of devices.
The adhesives commonly used in global electronics manufacturing mainly constitute raw materials such as acrylics, epoxies, silicone and polyurethanes. These are selected on the basis of their capacity for strong bonding, electrical insulation, heat absorption and resistance to moisture and environmental stress. Conductive adhesives may contain silver or other metals for electronic component attachment by electrical conduction. Adhesives in the global electronics industry can differ markedly with regard to their pricing due to factors like formulation complexity, performance specifications and volume purchasing agreements – comparing favorably with competing technologies including soldering and mechanical fastening whose costs reflect technological improvements, regulations stipulations as well as the precision required during assembly process of electronics that should be reliable.
• Lucintel forecasts that thermally conductive adhesives is expected to witness higher growth over the forecast period.
• Within this market, printed circuit board is expected to witness the higher growth.
The adhesives commonly used in global electronics manufacturing mainly constitute raw materials such as acrylics, epoxies, silicone and polyurethanes. These are selected on the basis of their capacity for strong bonding, electrical insulation, heat absorption and resistance to moisture and environmental stress. Conductive adhesives may contain silver or other metals for electronic component attachment by electrical conduction. Adhesives in the global electronics industry can differ markedly with regard to their pricing due to factors like formulation complexity, performance specifications and volume purchasing agreements – comparing favorably with competing technologies including soldering and mechanical fastening whose costs reflect technological improvements, regulations stipulations as well as the precision required during assembly process of electronics that should be reliable.
• Lucintel forecasts that thermally conductive adhesives is expected to witness higher growth over the forecast period.
• Within this market, printed circuit board is expected to witness the higher growth.
Country Wise Outlook for Adhesive in the Electronic Market
The adhesive in the electronic market is witnessing substantial growth globally, driven by increasing demand for adhesives capable of bonding smaller and more intricate electronic components. Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. Below image highlights recent developments by major adhesive in the electronic producers in key regions: the Canada, UK, Brazil, India, and China.
Emerging Trends in Adhesive in the Electronic Market
Emerging trends in adhesive in the electronic market shaping its future applications and market dynamics:
• Miniaturization and Advanced Packaging: Adhesives that back the trend to tinier and sleeker electronic gadgets inclusive of bendable displays which require excellence in fixing through bonding.
• Conductive Adhesives: A leap in conductive adhesives being used for flexible electronics, wearables, smart textiles; it allows for electrical connections without using traditional soldering methods.
• Environmental Sustainability: There is a rising request for eco-friendly glues with low volatile organic compounds (VOCs) emission rate and reduced environmental impact in each stage of their life cycle that supports global sustainability objectives.
• High Thermal Management: They are responsible for high-performance electronics heat dissipation such as CPUs or GPUs which consequently enhance the conductivity and reliability of electronic parts.
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Recent Development in Adhesive in the Electronic Market
Ongoing innovations and advancements in various sectors of adhesive in the electronic market which have been highlighted by recent developments:
• Henkel: Henkel launched a new line of electrically conductive adhesives designed for use in flexible electronics and wearable devices, enhancing connectivity and durability.
• 3M: 3M introduced a series of adhesive solutions optimized for thermal management in high-performance electronic applications, improving heat dissipation and component reliability.
• Dow: Dow developed a novel adhesive formulation tailored for next-generation OLED (Organic Light Emitting Diode) displays, enabling thinner profiles and improved display quality in mobile devices.
Strategic Growth Opportunities for Adhesive in the Electronic Market
Some key strategic growth opportunities for this market include:
Miniaturization and Lightweighting: In making electronic gadgets smaller and lighter, there is a rising need for glues that can bond fragile parts without significantly increasing their weights. Their criticality lies in formulations that provide great strength with minimum thickness.
Flexible Electronics: The mushrooming of wearable electronics calls for adhesives that can stick to different substrates such as plastics and textiles while remaining flexible enough to last through many bending cycles.
Thermal Management: Adhesive materials exhibiting good thermal conductivity are necessary for the removal of heat from high-performance electronic devices like CPUs and GPUs. Hence, more recently there has been increased demand for materials which release out heat very well but at the same time have electrical insulating properties.
Environmental Sustainability: Due to stringent regulations imposed by governments on manufacturers coupled with consumers’ demands on environmental friendly products, there is currently a move towards adhesives with low VOC emissions, utilize less energy during production and have high recyclability content.
Advanced Manufacturing Techniques: New approaches to manufacturing methods like additive manufacturing (3D printing) and automated assembly open up avenues where large-scale production necessitates adhesive coatings to be accurately applied in sufficient quantities.
Smart Electronics: With regard to smart components such as sensors, antennas, etc., being integrated into electronics (IoT applications), producers’ interest in adhesive innovations focuses on improved electrical characteristics and compatibility with electronic devises.
Adhesive in the Electronic Market Driver and Challenges
Rapid innovation and growing customer demand for smaller, more powerful devices are two main features of the global electronics market. This landscape relies heavily on adhesives as it attaches electronic components and substrates. Adhesives become even more significant as the industry moves towards miniaturization, flexibility, and better performance. This study investigates what is driving growth in the electronics adhesive industry, and what remains to be done to maximally take advantage of these opportunities.
The factors responsible for driving the adhesive market include:
Shrinking and Lightweighting: The trend of small and lighter electronics demand adhesives with small footprints and minimal weight gain.
Flexible and Wearable Electronics: Adhesives are a must-have component in bonding flexible substrates for applications such as wearable techs and fold-able monitors which increase the need for adhesive materials that can resist repeated bending or stretching.
Thermal Management: As electronic assemblies generate more heat, there is a concomitant increase in demand for adhesives that provide effective thermal conductivity so heat could be transferred away from the source to ensure devices’ optimal temperature during their operation.
Advanced Manufacturing Techniques: Innovations such as 3D printing. Automated assembly technologies call for accurate application of these materials leading to manufacturing processes becoming quicker thus lowering costs.
Smart Electronics and IoT: Adhesive products are needed to integrate sensors, antennas, among other smart components in electronics thereby enabling connectivity and functionality in IOT devices.
Challenges in the adhesive in elctronics market are:
Compatibility and Reliability: It is a demanding task to ensure compatibility and long-term reliability in different environmental conditions for adhesives with electronic materials such as metals, plastics, ceramics.
Thermal Cycling and Shock: Adhesives that can endure these stresses without weakening the bond are necessary for electronics subjected to thermal cycling or mechanical shock at work.
Environmental Regulations: Compliance with stringent laws on environment especially those regarding VOCs evaporation and hazardous substances poses a stiff challenge on adhesive makers.
Cost and Performance Balance: Costing of adhesives vis-à-vis their performance in terms of strength, flexibility, thermal conductivity among others, is an important consideration particularly in competitive electronic markets.
Technological Advancements: Continuously advancing technology in the field of electronics necessitates adhesives that can adapt to varying designs and manufacturing approaches hence the need for ongoing innovation and development.
The global market for electronic adhesives seems poised for strong growth driven by trends toward miniaturization, flexible electronics, and advanced manufacturing techniques. Nevertheless, issues like ensuring dependability, meeting environmental criteria as well as maintaining cost effectiveness have remained critical .To address this challenge adhesive manufacturers must continue innovating new technologies that synchronize with the ever changing trends in the semiconductor industry. As such they will successfully take advantage of available opportunities embedded into this rapidly changing arena of competition.
Adhesive in the Electronic Suppliers and Their Market Shares
In this globally competitive market, several key players such as Henkel AG, The 3M Company, Arkema SA, Parker Hannifin, etc. dominate the market and contribute to industry’s growth and innovation. These players capture maximum market share. To know the current market share of each of major players contact us.
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies adhesive in the electronic companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of adhesive in the electronic companies profiled in this report include-
• Henkel AG
• The 3M Company
• Arkema SA
• Parker Hannifin
These companies have established themselves as leaders in adhesive in the electronic industry, with extensive product portfolios, global presence, and strong research and development capabilities. They continually strive to enhance their market positions through strategic partnerships, mergers and acquisitions, and product innovations.
The market share dynamics within adhesive in the electronic market are evolving, with the entry of new players and the emergence of innovative adhesive in the electronic technologies. Additionally, collaborations between material suppliers, manufacturers, and end-users are fostering technological advancements and expanding market opportunities.
Adhesive in the Electronic Market by Segment
Notable growth is being experienced by a few major sections of the worldwide electronics adhesive market. The demand for versatile and lightweight electronic products is growing fast, hence the expansion of adhesives used in flexible electronics like wearable devices and flexible displays. Another segment that is expanding is thermal management adhesives which are needed to dissipate heat from high-performance electronics such as CPUs and GPUs. Furthermore, there has been an increase in the use of adhesives made for smart electronics and IoT applications because these involve incorporation of various sensors, antennas as well as other components that enhances their connectivity and other advanced functionalities. This arises out of advancing materials used in creating adhesives for these sectors in order to meet specific performance demands while accommodating changes in electronic devices form factor brought about by advancements on manufacturing techniques.
Adhesive in the Electronic Market by Product Type [Value from 2018 to 2030]:
• Thermally Conductive Adhesives
• Electrically Conductive Adhesives
• Others
Adhesive in the Electronic Market by Polymer Type [Value from 2018 to 2030]:
• Epoxy Based Electronics Adhesive
• Silicone Based Electronics Adhesive
• Acrylic Based Electronics Adhesive
• Polyurethane Based Electronics Adhesive
• Others
Adhesive in the Electronic Market by Application [Value from 2018 to 2030]:
• Printed Circuit Board
• Semiconductor Packaging
• Others
Adhesive in the Electronic Market by Region [Value from 2018 to 2030]:
• North America
• Europe
• Asia Pacific
• The Rest of the World
Features of Adhesive in the Global Electronic Market
Market Size Estimates: Adhesive in the electronic market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Adhesive in the electronic market size by product type, polymer type, application, and region in terms of value ($B).
Regional Analysis: Adhesive in the electronic market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different product types, polymer types, applications, and regions for adhesive in the electronic market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of adhesive in the electronic market.
Análisis de la intensidad competitiva de la industria basada en el modelo de cinco fuerzas de Porter.
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Preguntas frecuentes
Q1. What is the adhesive in the electronic market size?
Answer: The adhesive in the global electronic market is expected to reach an estimated $7.7 billion by 2030.
Q2. What is the growth forecast for adhesive in the electronic market?
Answer: The global adhesive in the electronic market is expected to grow with a CAGR of 6.1% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the adhesive in the electronic market?
Answer: The major drivers for this market are ongoing trend towards miniaturization in electronics, including smaller and more compact devices, growing adoption of electric vehicles (evs) and renewable energy technologies, and strong emphasis on improving the performance and reliability of devices.
Q4. What are the major segments for adhesive in the electronic market?
Answer: The future of the adhesive in the electronic market looks promising with opportunities in the printed circuit board and semiconductor packaging markets.
Q5. Who are the key adhesive in the electronic market companies?
Answer: Some of the key adhesive in the electronic companies are as follows:
• Henkel AG
• The 3M Company
• Arkema SA
• Parker Hannifin
Q6. Which adhesive in the electronic market segment will be the largest in future?
Answer: Lucintel forecasts that thermally conductive adhesives is expected to witness higher growth over the forecast period.
Q7. In adhesive in the electronic market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness the highest growth over the forecast period.
Q8. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.
This report answers following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for adhesive in the electronic market by product type (thermally conductive adhesives, electrically conductive adhesives, and others), polymer type (epoxy based electronics adhesive, silicone based electronics adhesive, acrylic based electronics adhesive, polyurethane based electronics adhesive, and others), application (printed circuit board, semiconductor packaging, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
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