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3D IC and 2.5D IC Packaging Market Trends and Forecast

The future of the global 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries. The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028 with a CAGR of 11% from 2023 to 2028. The major drivers for this market are growing demand for miniaturized IoT based devices, emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
3D IC and 2.5D IC Packaging Market by Packaging Technology, Application, and End Use Industry
A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown here. 
3D IC and 2.5D IC Packaging Market by Segments

3D IC and 2.5D IC Packaging Market by Segment

The study includes trends and forecast for the global 3D IC and 2.5D IC packaging market by packaging technology, application, end use industry, and region, as follows:

3D IC and 2.5D IC Packaging Market by Packaging Technology [Shipment Analysis by Value from 2017 to 2028]:

  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 3D Through-Silicon Via (TSV)
  • 2.5D

3D IC and 2.5D IC Packaging Market by Application [Shipment Analysis by Value from 2017 to 2028]:

  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Otros

3D IC and 2.5D IC Packaging Market by End Use Industry [Shipment Analysis by Value from 2017 to 2028]:

  • Consumer Electronics
  • Industrial
  • Telecommunications
  • Automotor
  • Military & Aerospace
  • Dispositivos médicos
  • Otros

3D IC and 2.5D IC Packaging Market by Region [Shipment Analysis by Value from 2017 to 2028]:

  • América del norte
  • Europa
  • Asia Pacífico
  • The Rest of the World

List of 3D IC and 2.5D IC Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, 3D IC and 2.5D IC packaging companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 3D IC and 2.5D IC packaging companies profiled in this report include- 
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • Toshiba
  • Advanced Semiconductor Engineering
  • Amkor Technology

3D IC and 2.5D IC Packaging Market Insights

  • Lucintel forecasts that the MEMS/sensor segment is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
  • Consumer electronics is expected to remain the largest segment due to the increasing adoption of 3D IC and 2.5D IC packaging based innovative memories, such as double-data-rate (DDR) DRAM and flash memory in the electronic devices, like smartphones and tablets.
  • APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs from the telecommunication and automotive industries, and the presence of key manufacturers in the region.

Features of the 3D IC and 2.5D IC Packaging Market

  • Market Size Estimates: 3D IC and 2.5D IC packaging market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: 3D IC and 2.5D IC packaging market size by various segments, such as by packaging technology, application, end use industry, and region
  • Regional Analysis: 3D IC and 2.5D IC packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different packaging technologies, applications, end use industries, and regions for the 3D IC and 2.5D IC packaging market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the 3D IC and 2.5D IC packaging market.
  • Análisis de la intensidad competitiva de la industria basada en el modelo de cinco fuerzas de Porter.

Preguntas frecuentes

Q1. What is the 3D IC and 2.5D IC packaging market size?
Answer: The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028.
Q2. What is the growth forecast for 3D IC and 2.5D IC packaging market?
Answer: The global 3D IC and 2.5D IC packaging market is expected to grow with a CAGR of 11% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of the 3D IC and 2.5D IC packaging market?
Answer: The major drivers for this market are growing demand for miniaturized IoT based devices, the emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
Q4. What are the major segments for 3D IC and 2.5D IC packaging market?
Answer: The future of the 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries.
Q5. Who are the key 3D IC and 2.5D IC packaging companies?
Answer: Some of the key 3D IC and 2.5D IC packaging companies are as follows:
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • Toshiba
  • Advanced Semiconductor Engineering
  • Amkor Technology
Q6.Which 3D IC and 2.5D IC packaging segment will be the largest in future?
Answer: Lucintel forecasts that MEMS/sensor is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
Q7. In 3D IC and 2.5D IC packaging market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs in the telecommunication and automotive industries, and presence of key manufacturers in the region.
Q8.Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

Este informe responde después de 11 preguntas clave

Q.1. What are some of the most promising, high-growth opportunities for the global 3D IC and 2.5D IC packaging market by packaging technology (3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and others), end use industry (consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?
 
For any questions related to 3D IC and 2.5D IC packaging market or related to 3D IC and 2.5D IC packaging companies, 3D IC and 2.5D IC packaging market size, 3D IC and 2.5D IC packaging market share, 3D IC and 2.5D IC packaging market growth, 3D IC and 2.5D IC packaging market research, write Lucintel analyst at email: helpdesk@lucintel.com we will be glad to get back to you soon.
 
Tabla de contenido
 
1. Executive Summary
 
2. Global 3D IC and 2.5D IC Packaging Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Global 3D IC and 2.5D IC Packaging Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
3.3.1: 3D Wafer-Level Chip-Scale Packaging (WLCSP)
3.3.2: 3D Through-Silicon Via (TSV)
3.3.3: 2.5D
3.4: Global 3D IC and 2.5D IC Packaging Market by Application
3.4.1: Logic
3.4.2: Imaging & Optoelectronics
3.4.3: Memory
3.4.4: MEMS/Sensors
3.4.5: LED
3.4.6: Others
3.5: Global 3D IC and 2.5D IC Packaging Market by End Use Industry  
3.5.1: Consumer Electronics
3.5.2: Industrial
3.5.3: Telecommunications
3.5.4: Automotive
3.5.5: Military & Aerospace
3.5.6: Medical Devices
3.5.7: Others
 
4. Market Trends and Forecast Analysis by Region from 2017 to 2028
4.1: Global 3D IC and 2.5D IC Packaging Market by Region
4.2: North American 3D IC and 2.5D IC Packaging Market
4.2.1: North American 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.2.2: North American 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.3: European 3D IC and 2.5D IC Packaging Market
4.3.1: European 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.3.2: European 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.4: APAC 3D IC and 2.5D IC Packaging Market 
4.4.1: APAC 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.4.2: APAC 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.5: ROW 3D IC and 2.5D IC Packaging Market 
4.5.1: ROW 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.5.2: ROW 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
6.1.2: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Application
6.1.3: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by End Use Industry
6.1.4: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Region
6.2: Emerging Trends in the Global 3D IC and 2.5D IC Packaging Market 
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global 3D IC and 2.5D IC Packaging Market 
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 3D IC and 2.5D IC Packaging Market 
6.3.4: Certification and Licensing
 
7. Company Profiles of Leading Players
7.1: Taiwan Semiconductor Manufacturing
7.2: Samsung Electronics
7.3: Toshiba
7.4: Advanced Semiconductor Engineering
7.5: Amkor Technology 
 
.

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Lucintel ha estado en el negocio de la consultoría de investigación y gestión de mercado desde 2000 y ha publicado más de 1000 informes de inteligencia de mercado en varios mercados / aplicaciones y atendió a más de 1,000 clientes en todo el mundo. Este estudio es una culminación de cuatro meses de esfuerzo a tiempo completo realizado por el equipo analista de Lucintel. Los analistas utilizaron las siguientes fuentes para la creación y finalización de este valioso informe:
  • Entrevistas en profundidad de los principales actores en este mercado
  • Investigación secundaria detallada de los estados financieros de los competidores y datos publicados 
  • Extensas búsquedas de obras publicadas, mercado e información de bases de datos relacionadas con noticias de la industria, comunicados de prensa de la empresa e intenciones de clientes
  • Una compilación de las experiencias, juicios e ideas de los profesionales de Lucintel, que han analizado y rastreado este mercado a lo largo de los años.
Se realizan una extensa investigación y entrevistas en la cadena de suministro de este mercado para estimar la cuota de mercado, el tamaño del mercado, las tendencias, los impulsores, los desafíos y las previsiones. A continuación se muestra un breve resumen de las entrevistas principales que se llevaron a cabo por la función de trabajo para este informe.
 
Por lo tanto, Lucintel compila grandes cantidades de datos de numerosas fuentes, valida la integridad de esos datos y realiza un análisis exhaustivo. Lucintel luego organiza los datos, sus hallazgos y las ideas sobre un informe conciso diseñado para respaldar el proceso estratégico de toma de decisiones. La siguiente figura es una representación gráfica del proceso de investigación de Lucintel. 
 

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